SPECIFICATIONS
Essentials
Status
EOIS
Launch Date
Q1'02
# of Cores
1
Clock Speed
1.7 GHz
L2 Cache
128 KB
FSB Speed
400 MHz
FSB Parity
No
Instruction Set
32-bit
Embedded Options Available
No
Lithography
130 nm
Max TDP
63.5 W
VID Voltage Range
1.75V
Recommended Customer Price
N/A
Memory Specifications
Physical Address Extensions
32-bit
ECC Memory Supported â¡
No
Package Specifications
TCASE
76°C
Package Size
35mm x 35mm
Processing Die Size
131 mm2
# of Processing Die Transistors
55 million
Sockets Supported
PPGA478
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology â¡
No
Intel® Hyper-Threading Technology â¡
No
Intel® Virtualization Technology (VT-x) â¡
No
Intel® 64 â¡
No
Idle States
No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
Intel® Platform Protection Technology
Trusted Execution Technology â¡
No
Execute Disable Bit â¡
No
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