Specifications
Essentials
Status
EOIS
Launch Date
Q4'03
# of Cores
1
# of Threads
1
Clock Speed
2.8 GHz
L2 Cache
512 KB
Bus/Core Ratio
21
FSB Speed
533 MHz
FSB Parity
Yes
Instruction Set
32-bit
Embedded Options Available
No
Supplemental SKU
No
Lithography
130 nm
Max TDP
74 W
VID Voltage Range
1.5V
Recommended Customer Price
N/A
Package Specifications
TCASE
C1+D1=75°C; M0=72°C
Package Size
42.5mm x 42.5mm
Processing Die Size
131 mm2
# of Processing Die Transistors
55 million
Sockets Supported
PPGA604
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
No
Intel® Trusted Execution Technology
No
Intel® 64
No
Idle States
No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
Execute Disable Bit
No
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