Specifications
Essentials
Status
Launched
Launch Date
Q2'04
Processor Number
370
# of Cores
1
# of Threads
1
Clock Speed
1.5 GHz
L2 Cache
1 MB
Bus/Core Ratio
15.0
FSB Speed
400 MHz
FSB Parity
No
Instruction Set
32-bit
Embedded Options Available
Yes
Supplemental SKU
No
Lithography
90 nm
Max TDP
21 W
VID Voltage Range
1.004V-1.292V
Recommended Customer Price
$70
Memory Specifications
Physical Address Extensions
32-bit
ECC Memory Supported
No
Package Specifications
TJUNCTION
100°C
Package Size
35mm x 35mm
Processing Die Size
87 mm2
# of Processing Die Transistors
144 million
Sockets Supported
H-PBGA478, H-PBGA479, PPGA478
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
No
Intel® Trusted Execution Technology
No
Intel® 64
No
Idle States
No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
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