Specifications
Essentials
Status
EOIS
Launch Date
Q4'04
Processor Number
330
# of Cores
1
# of Threads
1
Clock Speed
2.66 GHz
L2 Cache
256 KB
Bus/Core Ratio
20
FSB Speed
533 MHz
FSB Parity
No
Instruction Set
32-bit
Embedded Options Available
No
Lithography
90 nm
Max TDP
73 W
VID Voltage Range
1.250V-1.400V
Recommended Customer Price
N/A
Memory Specifications
Physical Address Extensions
32-bit
ECC Memory Supported
No
Package Specifications
TCASE
67°C
Package Size
35mm x 35mm
Processing Die Size
112 mm2
# of Processing Die Transistors
125 million
Sockets Supported
PPGA478
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
No
Intel® Trusted Execution Technology
No
AES New Instructions
No
Intel® 64
No
Idle States
No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
Execute Disable Bit
No
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