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SPECIFICATIONS
Essentials
Status
Launched
Launch Date
Q3'08
Processor Number
E8600
# of Cores
2
# of Threads
2
Clock Speed
3.33 GHz
L2 Cache
6 MB
Bus/Core Ratio
10
FSB Speed
1333 MHz
FSB Parity
No
Instruction Set
64-bit
Embedded Options Available
No
Supplemental SKU
No
Lithography
45 nm
Max TDP
65 W
VID Voltage Range
0.8500V-1.3625V
Tray 1ku Budgetary Price
$266.00
Package Specifications
TCASE
72.4°C
Package Size
37.5mm x 37.5mm
Processing Die Size
107 mm2
# of Processing Die Transistors
410 million
Sockets Supported
LGA775
Halogen Free Options Available
Yes
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Trusted Execution Technology
Yes
AES New Instructions
No
Intel® 64
Yes
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies
Yes
Execute Disable Bit
Yes
Essentials
Status
Launched
Launch Date
Q3'08
Processor Number
E8600
# of Cores
2
# of Threads
2
Clock Speed
3.33 GHz
L2 Cache
6 MB
Bus/Core Ratio
10
FSB Speed
1333 MHz
FSB Parity
No
Instruction Set
64-bit
Embedded Options Available
No
Supplemental SKU
No
Lithography
45 nm
Max TDP
65 W
VID Voltage Range
0.8500V-1.3625V
Tray 1ku Budgetary Price
$266.00
Package Specifications
TCASE
72.4°C
Package Size
37.5mm x 37.5mm
Processing Die Size
107 mm2
# of Processing Die Transistors
410 million
Sockets Supported
LGA775
Halogen Free Options Available
Yes
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
No
Intel® Virtualization Technology (VT-x)
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Trusted Execution Technology
Yes
AES New Instructions
No
Intel® 64
Yes
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies
Yes
Execute Disable Bit
Yes
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