Specifications
Essentials
Status
Launched
# of Cores
1
# of Threads
2
Clock Speed
2.4 GHz
L2 Cache
512 KB
Bus/Core Ratio
12
FSB Speed
800 MHz
Instruction Set
32-bit
Embedded Options Available
Yes
Lithography
130 nm
Max TDP
66.2 W
Recommended Customer Price
N/A
Package Specifications
TCASE
74°C
Processing Die Size
131 mm2
# of Processing Die Transistors
55 million
Sockets Supported
PPGA478
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology
No
Intel® Hyper-Threading Technology
Yes
Intel® Virtualization Technology (VT-x)
No
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