SPECIFICATIONS
Essentials
Status Launched
Launch Date Q2'07
Processor Number E4400
# of Cores 2
Clock Speed 2 GHz
L2 Cache 2 MB
FSB Speed 800 MHz
FSB Parity No
Instruction Set 64-bit
Embedded Options Available No
Lithography 65 nm
Max TDP 65 W
VID Voltage Range 0.8500V-1.5V
Recommended Customer Price N/A
Package Specifications
TCASE L2=61.4°C, M0=73.3°C
Package Size 37.5mm x 37.5mm
Processing Die Size 111 mm2
# of Processing Die Transistors 167 million
Sockets Supported LGA775, LGA775, LGA775, LGA775
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ⡠No
Intel® Hyper-Threading Technology ⡠No
Intel® Virtualization Technology (VT-x) ⡠No
Intel® 64 ⡠Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching No
Thermal Monitoring Technologies Yes
Intel® Platform Protection Technology
Trusted Execution Technology â¡ No
Execute Disable Bit â¡ Yes
Intel® Data Protection Technology
AES New Instructions No
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