Kingston HX324C11SRK2/16, kit of 2x 8GB DDR3 RAM

HX324C11SRK2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-2400 CL11 240-Pin DIMM

Description

HyperX HX324C11SRK2/16 is a kit of two 1G x 64-bit (8GB)
DDR3-2400 CL11 SDRAM (Synchronous DRAM) 2Rx8,
memory module, based on sixteen 512M x 8-bit FBGA
components per module.
Each module kit supports Intel®
XMP (Extreme Memory Profiles).
Total kit capacity is 16GB.
Each module has been tested to run at DDR3-2400 at a low
latency timing of 11-13-14 at 1.65V.
The SPDs are
programmed to JEDEC standard latency DDR3-1600
timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and
mechanical specifications are as follows:

XMP TIMING PARAMETERS
•
JEDEC: DDR3-1600 CL11-11-11 @1.5V
•
XMP Profile #1: DDR3-2400 CL11-13-14 @1.65V
•
XMP Profile #2: DDR3-2133 CL11-13-13 @1.6V

Specifications

CL(IDD) 11 cycles
Row Cycle Time (tRCmin) 48.125ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin) 260ns(min.)
Row Active Time (tRASmin) 35ns(min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0

Features

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal banks
• Programmable CAS latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (interleave without any limit, sequential with
starting address "000" only), 4 with tCCD = 4 which does not
allow seamless read or write (either on the fly using A12 or
MRS)
• Bi-directional Differential Data Strobe
• Internal (self) calibration: Internal self calibration through ZQ
pin (RZQ: 240 ohm
± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°Cº
• Asynchronous Reset
• Height 1.311" (33.30mm), w/heatsink, double sided component