AMD Phenom II Dual-Core Mobile N660

General information
Type CPU / Microprocessor
Market segment Mobile
Family AMD Phenom II Dual-Core Mobile
Model number ? N660
CPU part number
HMN660DCR23GM is an OEM/tray microprocessor
Stepping codes AAEKC AE NAEKC AE
Frequency ? 3000 MHz
Bus speed ? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
Clock multiplier ? 15
Package 638-pin lidless organic micro Pin Grid Array (UOL638)
AMD Package number 30600
Socket Socket S1 (S1g4)
Size 1.38" x 1.38" / 3.5cm x 3.5cm
Weight 0.2oz / 5.6g (measured)
0.2oz / 6.5g (by specifications)
Introduction date Jan 4, 2011
End-of-Life date Last order date is end of 3rd quarter 2011
Last shipment date is end of 1st quarter 2012
Architecture / Microarchitecture
Microarchitecture K10
Platform Danube
Processor core ? Champlain
Core stepping ? DA-C3
CPUID 100F63
Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology
Data width 64 bit
The number of CPU cores 2
The number of threads 2
Floating Point Unit Integrated, 128-bit wide
Level 1 cache size ? 2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
Level 2 cache size ? 2 x 1 MB 16-way set associative caches
Level 3 cache size None
Multiprocessing Uniprocessor
Extensions & Technologies
MMX instructions
Extensions to MMX
3DNow! technology
Extensions to 3DNow!
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSE4a ?
AMD64 / AMD 64-bit technology ?
AMD-V / AMD Virtualization technology
Security Features EVP / Enhanced Virus Protection ?
Low power features PowerNow!
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels (per controller): 2
Memory channels (total): 2
Supported memory: DDR3-1333, DDR3L-1066
Maximum memory bandwidth (GB/s): 21.3
Other peripherals HyperTransport technology 3.0
Electrical / Thermal parameters
Thermal Design Power ? 35 Watt